Photo Blast division
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- Photo Blast division
- Detailed specification
Our company conducts precision work on brittle materials such as ceramic, glass and ferrite through the use of photolitho and sand blasting technologies.
By spraying abrasive compounds consisting of fine particles from a nozzle onto various materials, we create through holes, conduct drilling and perform half processing, supplying products in a wide range of fields such as electronic components and devices.
Detailed specifications
Dimensions and tolerances
Penetration processing size
As a rule, We make the dimensions of D & W for processing the same as or greater than the sheet thickness (t).
single side processing size
Half processing enables the processing of both A and B types, and is possible from a width and depth (F) of 0.1mm. The base is R=FX80%
Taper shape
A taper angle of 70°is used when photo blasting.
surface roughness
If half processing, the side with the rough surface is the processed side.
