Photo Blast division
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- Photo Blast division
Our company conducts precision work on brittle materials such as ceramic, glass and ferrite through the use of photolithography and sandblasting technologies.
By spraying abrasive compounds consisting of fine particles from a nozzle onto various materials, we create through holes, conduct drilling and perform half processing, supplying products in a wide range of fields such as electronic components and devices.
Our mask plant manufactures photolithography masks, allowing us to offer start-to-finish production.
Proccesing Examples
Minute through-hole processing (glass)
Our proprietary photolithography technology allows us to create products with holes featuring entrances as small as 60 μm and exits as small as 30 μm. We will continue striving to make even smaller holes
Minute through-hole processing (silicon)
We now employ a direct pressure blast device that enables high aspect processing with taper angles of 85°.
Through-hole processing of glass
We can create plated through holes more efficiently and at less cost than mechanical processing can achieve. We can simultaneously create approximately 300,000 holes within a space of 12 inches.
Through-hole processing for sensor (glass・silicon)
Blasting allows us to collectively process plated through holes and target marks.
Through-hole processing of ferrite
We can create through holes with a dimensional precision of ±10μm. Sizes do not shrink, ensuring stable in-plane dimensional precision.
Concave processing for OEL
Sealing board for organic EL . Can be diced and delivered as chips.
Processing specifications
- Processing materials ...... brittle materials(ceramic,glass,ferrite,silicon etc)
- Processing size ...... less than 350X350mm,within thickness 1.2mm
